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2358 Curved 3D Three-Sided Glass ATX PC Case | BTF Back-Connect | Type-C | Wholesale OEM Available

  • OEM Curved Glass ATX Case, BTF Back-Connect Motherboard Supported
  • Integrated Curved Tempered Glass Side Panel, Premium Resale Appeal
  • Built-in USB 3.0 & Type-C Ports, OEM/ODM Private Label Available
  • ATX/M-ATX/ITX Compatible, 410mm GPU & 180mm CPU Cooler Support
  • 33mm Cable Space, Bottom Air Intake, Stable Quality for Bulk Orders
  • Compact Dual-Chamber PC Case with Three Side Glass Panel, Hidden AIO Tube Routing, Column-Free Three-Sided Glass 3D PRO ATX Computer Case
Case Size:
Design Style:
Motherboard Support:
Top Liquid Cooler:
  • Introduction
  • Specifications
  • FAQ
  • Recommended Products
  • Curved Glass Design for Premium Resale
    This bulk ATX case features an integrated curved tempered glass side panel, delivering a seamless, sleek view of internal builds. It matches top search demand for curved glass pc case, elevating product competitiveness in the gaming market.
  • BTF Back-Connect Motherboard Ready
    It supports BTF (back-to-front) ATX and M-ATX motherboards, aligning with the fast-growing trend for back connect pc case. This enables a clean, wire-free front view, attracting enthusiast builders and expanding your customer base.
  • Standard Type-C for Modern Use
    Equipped with dual USB 3.0 ports and a Type-C port as standard, it offers convenient front access for modern devices. This user-friendly I/O layout improves end-user satisfaction and boosts your resale conversion rates.
  • Spacious for High-End Hardware
    This mid-tower case fits 410mm long GPUs, 180mm tall CPU coolers, and 250mm ATX PSUs. Compatible with ATX/M-ATX/ITX motherboards, it covers mainstream to high-end gaming and workstation builds.
  • Builder-Friendly for Integrators
    With 33mm of rear cable management space and bottom fan mounting positions, this case simplifies assembly and airflow tuning. It is a practical choice for system integrators, effectively reducing your bulk build time and labor costs.
  • Reliable Quality & Brand Customization
    Built with 0.6–0.7mm SPCC steel, every unit passes strict factory quality inspections. We provide full OEM/ODM services and custom branding, ideal for private label projects and large wholesale orders.
  • Three Sides of Glass. No Pillars. No Blind Spots.
    A compact dual-chamber ATX mid tower built around a three-panel glass body. Front, left and right panels run edge to edge with no corner pillars and no stands at the base, so the case reads as one continuous panoramic window from any seat in the room. The dual-chamber layout moves the PSU and drive bay into a separate rear compartment, keeping heat and cable bulk off the display side. Back-connect motherboards route 24-pin, front panel and fan cables behind the tray, while a dedicated hidden channel carries AIO tubing down and out of the visible zone. What is left behind the glass is the build, not the wiring.
Model Name 2358
Dimension Chassis L430*W235*H470mm
Product L441*W235*H501mm
left Side Panel Integrated curved glass
Right Side Panel Metal panel
Chassis 0.60 - 0.70 SPCC (SPCC W/O Paint)
Default USB Config Power, Reset, 2 in 1 HD Audio, USB3.0×2, Type-C×1
Reserved Fan Ports
(MAX. Fan & AIO)
Top N/A
N/A
Front N/A
N/A
Rear 120mm*1 fan / 140mm*1 fan (Optional)
120mm / 140mm CPU Cooler(Optional)
Bottom 120mm*3 fans (Optional)
N/A
M/B 120mm*3 fans (Optional)
120mm / 240mm / 280mm / 360mm CPU Cooler(Optional)
Drive Bays 5.25'' 0
3.5'' 3
2.5'' 3 Combined with 3.5''
Motherboard ATX, M-ATX, ITX (BTF ATX & M-ATX)
PCI Slots 7
Max. VGA Card 410mm
Max. CPU Cooler 180mm
PSU ATX, length up to 250mm
Cable Management 33mm

2358 computer case (10).jpg2358 computer case (1).jpg

Commercial & OEM FAQ

Q: What are your strengths in chassis development?

A: We have more than 20 years of chassis development experience and launch new self-tooled products every year. Over the years, we have created multiple pioneering chassis designs and patented solutions, which allows us to support projects that require more than standard sourcing or simple logo customization.

Q: How is your chassis manufacturing system organized?

A: For chassis programs, we work with long-term joint-venture and deeply integrated manufacturing partners. These facilities cover assembly, stamping, plastic injection, painting, tooling, and related processes, and factory visits can be arranged in advance. Because our manufacturing partners and surrounding supply chain are closely integrated around our operation, the system is mature, stable, and cost-efficient.

Q: Do you support OEM and ODM projects for computer cases?

A: Yes. We support OEM and ODM development for front-panel styling, internal structure, logo application, color scheme, packaging, accessory sets, and project-specific appearance requirements.
In addition to standard OEM customization, we support deeper ODM programs with engineering, structural development, and ID design resources. This allows us to assist customers with customized chassis projects based on specific product positioning, market requirements, and branding goals.

Q: What is your MOQ?

A: For standard in-stock items, the MOQ can start from 1 piece. For customized case projects, the MOQ usually starts from around 300 pieces depending on tooling impact, structure changes, packaging, and target configuration.

Q: Can I order samples before mass production?

A: Yes. Samples are available for structure review, appearance confirmation, compatibility checking, and packaging evaluation. For customized projects, pre-production samples can be arranged after the design is confirmed.

Q: What is the typical lead time?

A: Standard products in stock are usually ready within 3 to 5 working days. For customized projects, the lead time is typically around 40 days after sample approval and order confirmation. For repeated orders, lead time is controlled to be 25-30 days.

Q: What is the warranty policy for cases? Is it the same for CKD or SKD shipments and fully assembled systems?

A: For fully assembled systems, we can normally provide a 1-year warranty. For case-only or loose-part shipments, we usually work with a 1% RMA allowance rather than a standard chassis warranty. If transport damage is identified after container unloading, compensation can be discussed case by case.

Q: What after-sales support do you provide for case projects?

A: Our after-sales support can include transport-damage review, missing-accessory follow-up, assembly guidance, and case-by-case claim handling according to the project agreement. For fully assembled systems, warranty service can be provided within the agreed period. For case-only shipments, we usually support customers through 1% designated RMA allowance, practical replacement handling, or evidence-based compensation review when logistics-related damage is confirmed.

Q: Can you support chassis-plus-PSU assembly, and can we supply the PSU ourselves?

A: Yes. We can support chassis-and-PSU assembly projects, including selected customer-supplied PSU arrangements after mechanical and assembly validation.

Q: Do you offer regional exclusivity for selected case models?

A: We offer regional exclusivity for selected case models and maintain a broad product portfolio to support market differentiation for customers in different regions. In most cases, exclusivity begins after sample confirmation and order placement, and the protection scope is tied to the approved panel design and the agreed target market. The standard protection period and any extension are based on the agreed annual volume commitment and program performance. During the exclusivity period, we will not offer the same approved design to other customers in the protected market.

Q: Can you provide RMB quotations for domestic projects?

A: Yes. RMB quotations can be issued for domestic projects. Final pricing should be confirmed case by case based on exchange rate, tax treatment, configuration, and current commercial terms.

Technical Product FAQ

Q: How do you ensure chassis compatibility and usability?

A: Our chassis development process covers concept definition, structural design, prototype review, validation, and production readiness assessment. Key checkpoints include motherboard compatibility, GPU clearance, CPU cooler height limit, radiator support, power supply fitment, storage layout, and cable-management space. This helps ensure the chassis is practical to build in and compatible with mainstream hardware configurations.

Q: How do you protect products during shipping?

A: All products undergo packaging drop testing based on ASTM D5276 before shipment. Our packaging is developed according to product structure, weight, and transportation requirements to provide stable protection during long-distance shipping and reduce the risk of transit damage. Based on customer requirements, we can also add extra protective packaging for improved shipping safety.

Q: How do you develop airflow performance in a case?

A: Airflow is reviewed from the early design stage. We evaluate vent opening, panel structure, fan mounting positions, internal obstruction, and design airflow path so the chassis can maximize cooling effect without creating unnecessary noise or assembly difficulty.

Q: What manufacturing processes are involved in case production?

A: Depending on the design, case production may involve sheet metal processing, bending, welding, stamping, plastic injection, surface treatment, painting, silk-screen printing, and final assembly. Manufacturability (DFM) is reviewed early to improve consistency and reduce production risk.

Q: Can you support CKD, SKD, and complete assembly projects?

A: Yes. We can discuss loose-part shipment, semi-knocked-down supply, fully assembled chassis delivery, or complete-system assembly according to the project scope and customer requirement.

Q: Can you install fans or customer-supplied PSUs into the chassis?

A: Yes. We can support assembly services for fans, power supplies, and selected customer-supplied components after fitment validation. Installation service rates are usually reviewed by project based on the required workflow and configuration complexity.

Q: What happens if there is shipping damage after unloading?

A: If damage is identified after container unloading, we will review the condition together with the customer and discuss a practical solution according to the transport evidence, project agreement, and actual loss condition.

Q: Do you follow a PQC standard during production?

A: Yes. We follow internal PQC standards during production to monitor key checkpoints such as cosmetic defects (including scratches, dents, paint defects etc.), structural fitment, assembly consistency, functional performance, and packaging condition. All I/O ports are also tested to ensure proper function and usability. This helps us identify issues early, maintain stable quality, and improve production consistency before shipment.

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